The Future of Ultrasound is Here

We’re building the next generation of ultrasound technology. With highly dense 2D arrays and an in-house silicon chip, our third generation of technology brings unlimited imaging modalities, omni-shear imaging, and 3D volumetric reconstructions to your fingertips.

Next-generation 2D arrays deliver higher spatial
resolution and true volumetric imaging

Unprecedented Detail

Massive 2D Arrays

High-density 2D arrays deliver markedly higher spatial resolution and true volumetric imaging, enabling finer detection of defects and faster, more repeatable inspections.

ASIC-Driven Precision

Powered by G3

Powered by our proprietary G3 silicon, our 3rd generation ultrasound tech delivers real-time volumetric imaging with superior signal-to-noise ratio and on-chip beamforming. Compact, rugged, and low-latency, it enables faster, more reliable defect detection.

All materials, geometries, and defect types

Unlimited Flexibility

One system – all materials, geometries, and defect types. Our 2D-array and G3 silicon combine to deliver unmatched material and geometric versatility—inspecting composites, metals, and plastics in any form-factor with a single platform. Detect hairline delaminations, porosity, cracks, inclusions, and bond failures while performing inline quality checks and batch inspections.

Built for Any Application

Scalable and Adaptable

Designed to be stackable, integratable, and modular, our ultrasound platform fits industries from aerospace and energy to manufacturing, infrastructure, and energy. Stack modules for broader coverage, integrate via standard APIs and robotic interfaces for inline or automated inspections, and swap configurable elements (frequency, form factor, compute) to match specific needs.

Built from Day 1 for AI Detection & Sizing

Foundational ML Models

DarkVision has already amassed the world’s largest UT datasets and utilizes scalable GPU compute to find and quantify defects hidden in billions of ultrasound images. Building on our existing 13 foundational AI models, deploying this next generation of ultrasound technology will take AI in the physical world to the next level.

Applications

Aerospace

Composite laminate quality, delamination, bond inspection

Prevent catastrophic incidents, loss of life, & improve manufacturing yield by finding & quantifying defects & damage early

Defense

Rapid inspection of structural parts and assemblies

Ensure military equipment availability to guarantee asset deployment speed

Manufacturing

Inline QA for high-volume production

Catch flaws early in base or finished products to reduce or eliminate costly downstream issues

Process Industries

Highly accurate quantification of corrosion, deformation, and cracking

Prevent plant downtime by quantifying key corrosion and cracking risks within assets in processing streams

Electronics

Lithium battery cell and PCB integrity

Prevent safety-critical anomalies from making it off the production line

Power Generation & Data Centers

Turbine blades, nuclear facilities, and data-center cooling systems

Inspection of critical power and process equipment to ensure power grids are reliable, including uptime protection of critical cooling systems in the age of AI